Dries Vande Ginste

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Dries Vande Ginste received the M.S. degree and the Ph.D. degree in electrical engineering from Ghent University, Gent, Belgium, in 2000 and 2005, respectively. He is currently a Full Professor at Ghent University and imec, heading the research lab quest. In June and July 2004, he was a Visiting Scientist at the Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign (UIUC), IL, USA. From September to November 2011, he was a Visiting Professor at the EMC Group, Dipartimento di Elettronica, Politecnico di Torino, Italy. He has authored or co-authored over 200 papers in international journals and in conference proceedings. His research interests include computational quantum mechanics and electromagnetics, electromagnetic compatibility, signal and power integrity.

Dr. Vande Ginste was awarded the International Union of Radio Science (URSI) Young Scientist Award at the 2011 URSI General Assembly and Scientific Symposium, the Best Poster Paper Award at the 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), the Best Paper Award at the 2013 IEEE Workshop on Signal and Power Integrity (SPI), the Best Paper Award at the 2013 IEEE International Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) and the Best Paper Award at the 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS). He also received the Best Paper Award of the IEEE Journal on Multiscale and Multiphysics Computational Techniques in 2021-2022. He served as the chair of the 2014 IEEE Workshop on Signal and Power Integrity. He is an Associate Editor for IEEE Transactions on Signal and Power Integrity and a Senior Member of the IEEE.

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