Tim Pattyn wins EPEPS 2025 Best Paper Award
(09-11-2025) Tim won the Best Paper Award at the 34th conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
For his paper on: Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors using a 3-D DSA Operator for Piecewise Homogeneous Structures.
T. Pattyn, X. Sun, E. Beyne, D. De Zutter, M. Huynen and D. Vande Ginste, "Broadband Electromagnetic Modeling of On-Chip Passives Using a Differential Surface Admittance Operator for 3-D Piecewise Homogeneous Structures," in IEEE Transactions on Microwave Theory and Techniques, doi: 10.1109/TMTT.2025.3600958.
Department of Information Technology, Ghent University - imec.
2025 EPEPS Conference
- October 19-22, 2025
- Milpitas, California
- The Design and Analysis Frontier for Electronic Packaging
About EPEPS
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.