A joint paper on modelling film stress has been accepted for publication.

(07-09-2021)

The joint paper with the research group of colleague Eric Chason (Brown university) has been accepted for publication in Journal of Applied Physics.

Title:

Understanding residual stress in thin films: analyzing wafer curvature measurements for Ag, Cu, Ni, Fe, Ti and Cr with a kinetic model

by Zhaoxia Rao, Sarah Berman, Peilin Yang, Diederik Depla, Eric Chason