A joint paper on modelling film stress has been accepted for publication.

The joint paper with the research group of colleague Eric Chason (Brown university) has been accepted for publication in Journal of Applied Physics.

Title:

Understanding residual stress in thin films: analyzing wafer curvature measurements for Ag, Cu, Ni, Fe, Ti and Cr with a kinetic model

by Zhaoxia Rao, Sarah Berman, Peilin Yang, Diederik Depla, Eric Chason